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PRODUCTS
Nanotherm products range from unique PCB board material to insulated heatsinks with record high thermal conductivity.

NANOTHERM™ – MB PCB MATERIAL
NANOTHERM™ substrate technology uses a patented nano-ceramic coating process to create a dielectric layer on the surface of an Aluminium substrate, creates a circuit layer for the interconnection of electronic devices. 

The nano-ceramic layer achieves an industry-leading thermal resistance due to it being between 4 and 10 times thinner than its competitors. The dielectric thermal conductivity is also 2-3 times higher (7W/mK) than conventional PCB dielectric materials.
  The NANOTHERM™ Metal-Backed PCB (MBPCB) is nano-ceramic dielectric layer formed directly on the surface of Aluminium substrate.  A subsequent metallisation layer, formed on the surface of NANOTHERM™ ceramic coating by bonding an ultra-thin (4-10 microns) layer of adhesive to create a circuit layer  uses an ultra-thin bond line to attach Copper foil metallisation. This can be patterned using standard PCB processing techniques.




Nanoceramic layers formed directly on an aluminium base of required shape enable the development of a new class electronic substrates with outstanding thermal conductivity and dielectric strength. These properties are well above those properties of standard Metal Core Printed Circuit Board (MC PCB) dielectrics as well as anodic and Micro Arc Oxide materials.

CHIP-ON-HEAT SINK

Chip-on-Heat Sink design for LED Light Engines
Placing LED chip directly on a heat sink provides the shortest thermal pass and offers an optimal thermal management solution for investigated LED devices. Electrical insulation of a conventional Aluminium heat sink is provided by application of a dielectric ceramic layer directly on its surface.

 

TECHNOLOGY
The Company has developed and patented a novel electro-chemical process for forming nanoceramic dielectric layers directly onto an aluminium base or arbitrary shape.
Technology is principally different from anodising, microarc oxidation or galvanic deposition and produces dense nano-crystalline oxide with high thermal conductivity and dielectric strength. X-ray analysis of nano-ceramic layers demonstrated that ceramic layer consists of aluminium oxide crystallites with average size of around 200 - 600Å (that is 20-60 nm).  
  The compact nano-crystalline structure of the developed ceramic material explains its high thermal conductivity (7 W/mK) and high dielectric strength (60-110 KV/mm) which are significantly above those properties of MC PCB dielectrics as well as anodic and Micro Arc Oxide coatings.

Due to the fully inorganic nature of the material, nanoceramic-aluminium substrates can work at high temperatures which are limited only by the working temperature of aluminium base and material properties are not affected by thermal degradation.


 

 

Nanoceramic layers formed directly on an aluminium base of required shape enable the development of a new class electronic substrates with outstanding thermal conductivity and dielectric strength. These properties are well above those properties of standard Metal Core Printed Circuit Board (MC PCB) dielectrics as well as anodic and Micro Arc Oxide materials.

NEWS AND EVENTS
Cambridge Nanotherm establishes first step towards mass manufacturing

Haverhill, Suffolk UK, 15th May 2013 - Electronics thermal management innovator Cambridge Nanotherm is to build its first prototype manufacturing plant in Haverhill, UK following the award of £250,000 in matched funding from the UK Innovation Agency - Technology Strategy Board (TSB).

Cambridge Nanotherm, the winner of the 2011 UK Clean Tech Open Competition, has developed and patented a unique nanoceramic-aluminum substrate for thermal management of electronics which offers the potential for major cost reductions and environmental benefits in electronics manufacturing.

Nanotherm™ substrate technology uses a proprietary nano-ceramic coating process to create a dielectric layer directly on to the surface of an aluminium substrate. The nano-ceramic dielectric layer is between two and 10 times thinner than its competitors and achieves an industry-leading thermal resistance of 0.014 Ccm2/W. It also has a dielectric thermal conductivity of 7 W/mK which is 2-3 times higher than conventional MB PCB (metal back printed circuit board) dielectric materials.

With the financial support from the TSB and from Cambridge Nanotherm shareholder Enso Ventures, the new state-of-the-art facility will both be a development platform for electronic applications of Nanotherm technology such as LED lighting and power electronics; and demonstrate the manufacturability of Nanotherm™ substrates in a volume production environment to potential licensees of the technology.

The prototype manufacturing line will be capable of producing innovative MB PCB materials with ceramic dielectric as well as groundbreaking circuit-on-heat-sink substrates.

Pavel Shashkov, CEO and founder of Cambridge Nanotherm said: “The Nanotherm™ technology has the potential to change the way in which LED light fixtures and power electronic substrates are designed and manufactured because it delivers better thermal performance, lower overall cost, smaller footprint and flexible design. This new facility is a major next step in the development of our patented technology and of the Cambridge Nanotherm business.”

About Technology Strategy Board: 

The Technology Strategy Board (TSB) is a UK Innovation Agency, a public body operating at arm's length from the UK Government. TSB aim is to accelerate economic growth by stimulating and supporting business-led innovation. This aim is achieved by being a catalyst; by highlighting opportunities; by connecting partners and networks and by funding - helping businesses of every size to transform great ideas into the growth products and services of tomorrow.

www.innovateuk.org

About Cambridge Nanotherm Ltd:

Cambridge Nanotherm Ltd, was established in 2010 to commercialise proprietary nano-ceramic technology for use in the electronic industry. The company was the UK winner of the 2011 Clean Tech Open Competition, sponsored by Silicon Valley Bank. The technology has been developed by internationally renowned scientists who have a track record for setting up successful high technology companies and commercialising innovative IP. The company was supported by TSB, EEDA and ERDF grants and was a member of the Carbon Trust Fast-track Entrepreneur Programme. Cambridge Nanotherm Ltd is financially backed by Enso Ventures.

www.camnano.com

Contact:

Camille Closs

+44 (0)20 8286 0654

Watch PR

camille@watchpr.com

 

Colin Dore, Business Development Manager

info@camnano.com

3b Homefield Road, Haverhill, Suffolk. UK.

CB9 8QP

+44 (0) 208 330 4286

Cambridge Nanotherm and Spirit Circuits sign Value Added Reseller agreement

Southern Manufacturing Show, Farnborough UK – 14th February 2013 – Following the recent launch of its Nanotherm™ MBPCB (Metal-Backed Printed Circuit Board) product, Cambridge Nanotherm has signed its first value added reseller (VAR) agreement with UK-based printed circuit board (PCB) maker Spirit Circuits.

Cambridge Nanotherm has developed a unique process for converting Aluminium into Alumina (Aluminium Oxide [Al2O3]). The process allows the surface of an Aluminium plate to be converted into a layer of Alumina – which acts as a dielectric. A range of standard Printed Circuit Board fabrication techniques can then be used to apply circuitry onto the nano-ceramic dielectric layer.

“We are very pleased be the first Value Added Reseller of NanothermTM in UK as that will allow our customers access to this leading edge thermal management product,” said Steve Driver, Spirit’s Managing Director. “The Nanotherm product will provide our customers with better thermal performance and smaller footprints for thermally challenged designs in both the LED lighting and power electronics segment.”

Pavel Shashkov, Cambridge Nanotherm’s CEO said: “We are delighted to have signed this VAR agreement with Spirit. Their thermal management expertise and capability in the field of MBPCB will allow us to expand our access to market and provide their customers and design engineers with Nanotherm material for their demanding applications.”

 

About Spirit Circuits Ltd:

 

   

Spirit Circuits is a PCB and MBPCB manufacturer based in Waterlooville, Hampshire. They offer an extensive complement of PCB’s, from single sided through to complex multi-layers. They are certified by the internationally recognised ISO9001 quality standard. Spirit supply to the Telecoms, Defence, Medical, LED Lighting and Industrial Markets.

 

About Cambridge Nanotherm Ltd:

 

   

Cambridge Nanotherm Ltd, was established in 2010 to commercialise proprietary nano-ceramic technology for use in the electronic industry. The company was the UK winner of the 2011 Clean Tech Open Competition, sponsored by Silicon Valley Bank. The technology has been developed by internationally renowned scientists who have a track record for setting up successful high technology companies and commercialising innovative IP. The company was supported by TSB, EEDA and ERDF grants and was a member of the Carbon Trust Fast-track Entrepreneur Programme. Cambridge Nanotherm Ltd is financially backed by Enso Group.

www.camnano.com

Contact:

Camille Closs

+44 (0)20 8286 0654

Watch PR

camille@watchpr.com

 

Colin Dore, Business Development Manager

info@camnano.com

3b Homefield Road, Haverhill, Suffolk. UK.

CB9 8QP

+44 (0)1440 762 159

Cambridge Nanotherm Ltd launches its industry-leading Nanotherm™ Metal-backed PCB product which enables a reduction in LED device temperature of up to 20°C

Haverhill, Suffolk UK, January 14th 2013 – Cambridge Nanotherm has launched Nanotherm™ MBPCB (Metal-Backed Printed Circuit Board), the culmination of two years of innovative development using Cambridge Nanotherm’s ceramic dielectric technology. This has resulted in an innovative thermal management material, with a dielectric thermal conductivity of 7 W/mK, which is able to significantly reduce LED die temperatures – even in the most thermally challenging Luminaire designs.

The company’s core IP exists in its unique process for converting Aluminium into Alumina (Aluminium Oxide [Al2O3]). This process allows the surface of an Aluminium plate to be converted into a layer of Alumina – which acts as a dielectric. A range of standard Printed Circuit Board fabrication techniques can then be used to apply circuitry onto the nano-ceramic dielectric layer.

“This nano-ceramic dielectric not only provides excellent electrical isolation, but also has a thermal performance which is much improved over the standard filled epoxies used for conventional thermal management dielectrics”, explained Dr Pavel Shashkov, CEO and Founder, Cambridge Nanotherm. “The ceramic layer has a bulk thermal conductivity of 6-7 W/mK and can be applied in thicknesses as low as 10 micron, resulting in a thermal resistance as low as 0.012°Ccm 2 /W.”

Independent testing of the Nanotherm™ MBPCB, in LED lighting applications, has shown that it offers a 20% reduction in substrate thermal resistance over some of the best available metal-backed PCBs. In back-to-back comparison testing with other metal-backed PCBs, LED temperatures were seen to be reduced by as much as 20°C, thus allowing designers to increase component density and power or give longer lifetime guarantees.

Cambridge Nanotherm sees its new thermal management material as an important addition to its customers’ material toolboxes – reducing the need to move to more expensive Copper-backed PCBs as thermal challenges arise.

Steven Curtis, Nanotherm’s Head of Product Development added: “We are quickly moving ahead with the development of our next generation product, Nanotherm™ PLUS, which, by direct metallisation of the nano-ceramic layer, produces an MBPCB with a thermal performance approaching that of Aluminium Nitride (AlN) ceramic tile.

“This substrate material will offer an alternative to those designers who need the excellent performance of AlN in their packages or arrays, but need to meet very tight cost targets.”

 

About Cambridge Nanotherm Ltd:

 

Cambridge Nanotherm Ltd, was established in 2010 to commercialise proprietary nano-ceramic technology for use in the electronic industry. The company was the UK winner of the 2011 Clean Tech Open Competition, sponsored by Silicon Valley Bank. The technology has been developed by internationally renowned scientists who have a track record for setting up successful high technology companies and commercialising innovative IP. The company was supported by TSB, EEDA and ERDF grants and was a member of the Carbon Trust Fast-track Entrepreneur Programme. Cambridge Nanotherm Ltd is financially backed by Enso Group. www.camnano.com

Contact:

Camille Closs

+44 (0)20 8286 0654

Watch PR

camille@watchpr.com

 

Colin Dore, Business Development Manager

info@camnano.com

3b Homefield Road,

Haverhill,

Suffolk UK

First LED chip-on-Al heatsink device produced and evaluated

19-21  September 2012, participation at “Strategies in Light Europe 2012”, Munich.  Visit our booth B35 
http://www.sileurope.com/index.html

CN presents “Nanoceramic Aluminium Substrates”

CN presents “Nanoceramic Aluminium Substrates” at Smart Lighting Conference, Dusseldorf, Germany

Cambridge Nanotherm comes second in the Global Cleantech Ideas Final

Cambridge Nanotherm comes second in the Global Cleantech Ideas Final, San Jose, USA.

http://www.cleantechopen.com/app.cgi/news/press_releases/75/view

 

CN secures its funding first round with ENSO Ventures.

CN secures its funding first round with ENSO Ventures.

Cambridge Nanotherm becomes a Winner of UK Cleantech Ideas Competition 2011

Cambridge Nanotherm becomes a Winner of UK Cleantech Ideas Competition 2011.

http://www.thelongrunventure.com/ideas/finalists/

Strategies in Light Europe Conference

Strategies in Light Europe Conference

http://www.sileurope.com


Presentation “Nanoceramic-Aluminium Substrates for Solid State Lighting” , Cambridge Nanotherm

Successful completion of TSB project on investigation of properties of nanoceramic – aluminium

Successful completion of TSB project on investigation of properties of nanoceramic – aluminium. Direct measurement of LED based on nanoceramic demonstrated 23C LED temperature reduction compared with traditional PCB board.

Cambridge News “Cambridge leads way in clean tech industry”

Cambridge News “Cambridge leads way in clean tech industry”. First demonstration of Nanoceramic LED Substrate at Cambridge Smartlife Centre.

ABOUT US

Cambridge Nanotherm Ltd, was established in 2010 to commercialise proprietary nano-ceramic technology for use in the electronic industry. The technology has been developed by internationally renowned scientists who are co-founders of the company. The management team has a track record for setting up successful high technology companies and commercialising innovative IP. The core team previously started businesses in Cambridge.

In Novermber 2011 Enso Ventures Limitied, a private equity and technology boutique firm, became an investor in Cambridge Nanotherm. 

The Management Team:

Dr. Pavel Shashkov

CEO

Over 20 years of experience in building and running high tech companies. 

 

Thomas Dahl

VP Sales 

CEO and Owner of global sales and technical consultancy company with wide links to LED industry.

 

Eward McGill 

Financial Controller

Edward worked at British Museum's investment fund and the John Lewis Pension Fund. 

 

Sergey Usov

VP Operations

Technology, manufacturing and licensing expert.

 

 

Steven Curtis 

VP Product Development

17 years of product development and manufacturing experience.

 

 

 

Advisory Board:

 Nikolay Danilov

 Director

Enterpreneur and investor. Managing Director of Enso Ventures.

 

 

 

Kim Berknov

 Director

Over 15 years of private equity experience. Partner at Enso Ventures.

 

Kirill Mudryy

 Director

Qualified solicitor. Investment Manager at Enso Ventures.

 

CONTACT
Cambridge Nanotherm Limited


3b Homefield Road,

Haverhill,

Suffolk

CB9 8QP

United Kingdom

T +44 (0)1440 762 159
F +44 (0)5601 155 767
info@camnano.com
www.camnano.com